Tuesday, July 14, 2009

Novellus, UAlbany $20 R&D Partnership launched

The equipment supplier will locate researchers and tools at Albany's College of Nanoscale Science and Engineering to support development of sub-22-nm technologies.

By Suzanne Deffree,

The College of Nanoscale Science and Engineering (CNSE) at the University at Albany and Novellus Systems Inc have formed a $20 million partnership to conduct next-generation R&D in sub-22nm semiconductor manufacturing technology.

As part of the agreement, the equipment supplier will install three advanced thin-film deposition tools -- a VECTOR plasma-enhanced chemical vapor deposition system, a SABRE copper electrochemical deposition system, and an ALTUS tungsten chemical vapor deposition system -- at CNSE's Albany NanoTech complex.

Further, a team of Novellus researchers will be located with CNSE staff at Albany NanoTech. The team will conduct research into advanced nanofabrication processes including copper fill for interconnects, copper through-silicon via fill for 3-D packaging applications, tungsten deposition for transistor contacts, and thin dielectric film deposition.

"Novellus Systems is pleased to engage in this next-generation research and development program in collaboration with the College of Nanoscale Science and Engineering," said Tom Caulfield, Novellus executive VP of sales, marketing, and customer satisfaction, in a statement. "Combining the technological expertise of Novellus, with the intellectual know-how and assets of CNSE, will accelerate the development of innovations needed to drive our industry forward."

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